CORE BUSSINESS
QFN TAPE
QFP TAPE
UV TAPE
ESD UV TAPE
BG TAPE
QFN lead frame protection tape is a tape specially used for chip packaging processes. It is mainly used to stick to the back of the chip lead frame to prevent Molding resin from penetrating into the shielding area during the Molding process. This tape has good temperature resistance and anti-static properties, and can be used in high temperature environments and has no residual glue after removal.
QFP pin fixing tape is used in various IC packaging, and the hot pressing process arranges components on the lead frame in an orderly manner. 3KZ-QFP66, mainly designed for IC packages, pin xation.
BG Tape is a key protective material in semiconductor wafer thinning process. Through high-precision bonding and controllable peeling technology, the integrity and yield of the chip in processing is ensured.
ESD UV tape achieves a balance between wafer protection, electrostatic protection and process compatibility in semiconductor manufacturing through anti-static, rapid curing, easy peeling and other characteristics. It is a key auxiliary material for advanced processes (such as 3D integration, heterogeneous packaging).
After UV tape is cured by ultraviolet irradiation, the wafer and support glass can be quickly bonded to form a temporary fixed structure. This bonding method can keep the wafer stable during processing, avoid movement or damage, and protect the wafer surface from contaminants.
CERTIFICATION
ISO14001认证
ISO9001认证
QC080000认证
MAO SEN COMPANY PROFILE
Guangdong Maosen Chip Materials Co., Ltd., a subsidiary of 3T Technology International Group, was established in 2011 with a registered capital of 139 million yuan. The company owns a 50,000-square-meter self-built modern factory integrating R&D, production, and administrative centers, equipped with standard 10,000-class cleanroom workshops, 9 precision coating lines with 100-class cleanrooms, and ultra-precision slitting equipment. Our professional R&D team has long been dedicated to the development and production of application solutions for auxiliary materials such as Chip factory, Wafer, Semiconductor, and New energy. The company has obtained three major certifications: ISO9001, ISO14001, and QC080000. Main products include QFN packaging tape, QFP tape, UV dicing film, wafer thinning BG tape, and other semiconductor process application materials, which can perfectly compete with American, Japanese, and Korean brands. We aim to help semiconductor-related customers achieve cost reduction, efficiency improvement, and domestic substitution while creating value, improving chip yield, reducing power consumption, supporting sub-5nm processes, and addressing random defects encountered during packaging. We specialize in the R&D and production of semiconductor process materials.
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