Stable viscosity, good exhaust effect, acid and alkali resistance.
Touch, display panel, QFN copper sheet wet film anti-silver leakage and other surface protection functions.

Features and Applications:
High Temperature Resistance: These tapes typically maintain their performance under high-temperature conditions and, depending on the
material type, can withstand temperatures of several hundred degrees Celsius. Adhesion: High-temperature tapes generally exhibit strong adhesion and can be used for securing and protecting various materials,
including metals and chip packaging.
Insulation Properties: These tapes are typically electrically insulating, making them suitable for isolating and insulating electrical
components to prevent short circuits. Chemical Resistance: This high-temperature tape offers high resistance to chemicals and solvents, can withstand plasmas, and helps
prevent chemical corrosion. Mechanical Strength: This high-temperature tape possesses sufficient mechanical strength to remain stable under high temperatures,
preventing loosening and detachment.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant tohydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left whencutting small-sized products.
Suitableforcuttingelectronic components, wafers, glass, ceramics, lenses, and chip processes in thesemiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to
hydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
electronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant tohydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
Suitableforcuttingelectronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to
hydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
electronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to
hydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
electronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.