On March 27, 2024, the financial sector reported that, according to the announcement of the China National Intellectual Property Administration, Changxin Storage Technology Co., Ltd. has obtained a project entitled "Wafer Structure, Wafer Structure Cutting Methods and Chips", the authorization announcement number is CN107680937B, and the application date is September 2017.
The patent abstract shows that the present invention relates to a wafer structure, a wafer structure cutting method, and a chip. The wafer structure comprises a wafer body, which has an active surface, and the chip is set in the wafer body; The active surface includes a first peripheral area, a first solder pad arranged on the installation surface of each chip, and a second solder pad arranged on the first peripheral area; Each chip has an outer convex structure, where the second solder pad on the outer convex structure is adjacent to the first solder pad of adjacent chips. The cutting method includes planning a cutting path, which is located in the first gap of the first peripheral area; Cut the wafer along the cutting path to obtain the chip. The chip includes a mounting surface and an external convex structure, which is located on one side of the mounting surface where there is a first solder pad, and a second solder pad is set on the external convex structure. The present invention adopts plasma cutting to reduce the chip spacing, thereby arranging more chips. The second solder pad on the first peripheral area can expand the number of interfaces between adjacent chips.
