According to a report from Jiweiwang, TSMC held the 2024 North American Technology Forum in California, USA at the end of April, announcing six major semiconductor technology innovations including its latest semiconductor process technology A16 (1.6nm), next-generation advanced packaging, and 3D chip technology, which attracted industry attention. Under the global trend of developing artificial intelligence (AI), TSMC has become the most important foundry for AI chips such as Nvidia, thanks to its leading chip technology and stable expansion of production capacity.

Semiconductor technology is an indispensable technology in today's world, which affects various aspects of our lives. Its importance stems from its ability to manufacture small and precise electronic devices that can control current and information flow at the electronic level. This control capability enables us to create processors with extremely fast computing speeds, chips that store large amounts of data, devices that enable high-speed communication, and even scientific tools for exploring unknown fields.

On April 28th, in the financial industry, an investor asked Huagong Technology on an interactive platform: Jiufengshan Laboratory, in collaboration with Huagong Technology, is promoting collaborative innovation and achieving the latest achievement in the localization of high-end equipment - the national production of semiconductor wafer laser cutting machines has completed pilot testing and is expected to become a new growth point for enterprises in the future. May I ask if the semiconductor equipment company is involved in the design and manufacturing? Does the company have plans to enter advanced semiconductor manufacturing equipment?

US technology website revealed that Huawei and Chinese chip manufacturer SMIC plan to collaborate in the development of 3-nanometer process chips.

In the past two years, the semiconductor industry has been affected by various factors such as lower than expected market recovery in the downward cycle and tight funds. Intel, TSMC, Samsung, and other large factories are continuously adjusting and slowing down the construction speed and pace of wafer fabs to better serve the long-term development goals of the enterprise while maintaining the trend of expanding production. According to incomplete statistics from Global Semiconductor Watch, since the first half of this year, the construction of two factories, Intel's 1nm chip factory in Germany and the Ohio factory in the United States, Samsung's Pingze chip factory in South Korea and Taylor wafer factory in the United States have been delayed, and TSMC's two factories in Arizona have been delayed in production. In addition, the construction of Wolfspeed Germany's 8-inch SiC wafer factory may be postponed until 2025.

On May 31st, IT Home reported that a representative of Samsung Electronics stated at the AI-PIM seminar in South Korea yesterday that it is gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed.

On March 27, 2024, the financial sector reported that, according to the announcement of the China National Intellectual Property Administration, Changxin Storage Technology Co., Ltd. has obtained a project entitled "Wafer Structure, Wafer Structure Cutting Methods and Chips", the authorization announcement number is CN107680937B, and the application date is September 2017.

On May 10th, KuaiTech reported that for domestic semiconductor manufacturers, it will still be difficult to produce chips of 7nm and below for a long time in the future.