On April 28th, in the financial industry, an investor asked Huagong Technology on an interactive platform: Jiufengshan Laboratory, in collaboration with Huagong Technology, is promoting collaborative innovation and achieving the latest achievement in the localization of high-end equipment - the national production of semiconductor wafer laser cutting machines has completed pilot testing and is expected to become a new growth point for enterprises in the future. May I ask if the semiconductor equipment company is involved in the design and manufacturing? Does the company have plans to enter advanced semiconductor manufacturing equipment?
The company responded that it actively explores new application space in the field of precision micro nano laser equipment and has developed laser wafer precision cutting equipment in the semiconductor application field, mainly used for the cutting/slotting process of third-generation semiconductor materials such as silicon carbide wafers. At present, the device has completed product development. In terms of third-generation semiconductor post processing technology, the company has demonstrated fully automatic wafer laser annealing intelligent equipment and fully automatic wafer laser modification and cutting intelligent equipment at the 2024 Jiufengshan Forum and China International Compound Semiconductor Industry Expo. They are mainly used in SiC, GaN power and RF devices/chips, and are widely used in fields such as smart cars, photovoltaics, and 5G communication.
