Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.

Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.

Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.

Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no glue threads
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.

Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.

It has low initial adhesion,low peeling force increase, easy to cut, not easy to stickto the axis,suitable for full-automatic QFN film laminating machine.
Suitable for QFN copper coil electroplating shielding protection.
Excellent high temperature resistance and acid and alkali resistance.

It has low initial adhesion,low peeling force increase, easy to cut, not easy to stickto the axis,suitable for full-automatic QFN film laminating machine.
Suitable for QFN copper coil electroplating shielding protection.
Excellent high temperature resistance and acid and alkali resistance.

It has low initial adhesion,low peeling force increase, easy to cut, not easy to stickto the axis,suitable for full-automatic QFN film laminating machine.
Suitable for QFN copper coil electroplating shielding protection.
Excellent high temperature resistance and acid and alkali resistance.

It has low initial adhesion,low peeling force increase, easy to cut, not easy to stickto the axis,suitable for full-automatic QFN film laminating machine.
Suitable for QFN copper coil electroplating shielding protection.
Excellent high temperature resistance and acid and alkali resistance.

Features and Applications:
High Temperature Resistance: These tapes typically maintain their performance under high-temperature conditions and, depending on the
material type, can withstand temperatures of several hundred degrees Celsius. Adhesion: High-temperature tapes generally exhibit strong adhesion and can be used for securing and protecting various materials,
including metals and chip packaging.
Insulation Properties: These tapes are typically electrically insulating, making them suitable for isolating and insulating electrical
components to prevent short circuits. Chemical Resistance: This high-temperature tape offers high resistance to chemicals and solvents, can withstand plasmas, and helps
prevent chemical corrosion. Mechanical Strength: This high-temperature tape possesses sufficient mechanical strength to remain stable under high temperatures,
preventing loosening and detachment.

Features and Applications:
High Temperature Resistance: These tapes typically maintain their performance under high-temperature conditions and, depending on the
material type, can withstand temperatures of several hundred degrees Celsius. Adhesion: High-temperature tapes generally exhibit strong adhesion and can be used for securing and protecting various materials,
including metals and chip packaging.
Insulation Properties: These tapes are typically electrically insulating, making them suitable for isolating and insulating electrical
components to prevent short circuits. Chemical Resistance: This high-temperature tape offers high resistance to chemicals and solvents, can withstand plasmas, and helps
prevent chemical corrosion. Mechanical Strength: This high-temperature tape possesses sufficient mechanical strength to remain stable under high temperatures,
preventing loosening and detachment.

Features and Applications:
High Temperature Resistance: These tapes typically maintain their performance under high-temperature conditions and, depending on the
material type, can withstand temperatures of several hundred degrees Celsius. Adhesion: High-temperature tapes generally exhibit strong adhesion and can be used for securing and protecting various materials,
including metals and chip packaging.
Insulation Properties: These tapes are typically electrically insulating, making them suitable for isolating and insulating electrical
components to prevent short circuits. Chemical Resistance: This high-temperature tape offers high resistance to chemicals and solvents, can withstand plasmas, and helps
prevent chemical corrosion. Mechanical Strength: This high-temperature tape possesses sufficient mechanical strength to remain stable under high temperatures,
preventing loosening and detachment.