|
-
Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.
-
Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.
-
Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.
-
Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no glue threads
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.
-
Excellent cleanliness and good surface smoothness.
Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.
Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.
|
|