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3KZ UV-FREE CUTTING FILM

免UV切割蓝膜TDS3KZ-WL3080_00.jpg

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Excellent cleanliness and good surface smoothness.

Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no gluethreads.

Applicable to the semiconductor industry,wafer, chip cutting, and flipping processes.

洁净度优、胶面平整性好。（Excellent cleanliness and good surface smoothness）
粘性稳定，贴合性能好，易于扩晶与切割，不残胶，不留胶丝。 (Stable viscosity, good adhesion, easy to expand and cut, no residual glue, no glue threads)
适用于半导体行业、晶圆、芯片切割，翻转制程。（Applicable to the semiconductor industry, wafer, chip cutting, and flipping processes.）