It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant tohydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left whencutting small-sized products.
Suitableforcuttingelectronic components, wafers, glass, ceramics, lenses, and chip processes in thesemiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to
hydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
electronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant tohydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
Suitableforcuttingelectronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to
hydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
electronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.

It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to
hydrofluoric acid and can withstand high temperatures of 130° C/3 hours.
There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products.
electronic components, wafers, glass, ceramics, lenses, and chip processes in the
semiconductor industry.