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3KZ UV TAPE WAFER FRONT-END CUTTING FILM
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It has good adhesion before UV irradiation,and the viscosity will besignificantly reduced after UV irradiation, allowing easy peeling. It is resistant to hydrofluoric acid and can withstand high temperatures of 130° C/3 hours. There is no residual glue and pollution during use, and no residual glue is left when cutting small-sized products. electronic components, wafers, glass, ceramics, lenses, and chip processes in the semiconductor industry. |
